Latest thermal gap filler material company |

thermal gap filler material description

thermal gap filler material has the advantage of cpu gel , which is used in cooler master gel .

Latest thermal gap filler material company-1

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thermal gap filler material SPECIFICATIONS

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During the developing stage of Furui cooler master gel, the design apartment strives to achieve an ultra slim design with mature screen touch technology.

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Furui cpu gel is made from top-grade semiconductor materials and the plastic casing which are all well-selected before entering the factory.

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CAD lofting software is exclusively used in the design of Furui cpu gel in the preliminary stage. Its size and shape accuracy can be guaranteed by this precise software.

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The manufacturing process of the crystalline semiconductor of Furui cooler master gel is complicated and technical. The crystalline semiconductor must be processed in a high temperature and pressure environment together with phosphor and gallium.

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Furui cpu gel is dyed using precise combinations of pressure, temperature and time. Through this process, its color effect is satisfying.

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The product is characterized by high performance and stable quality.

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